Key features

AMATECH™ Linkobond – TC954 & H75 Gap Filler Compound is designed for efficient gap filling of various devices. This is an advanced PU Cell Fill Technology. The material is design to expand upto 500% after mixing the two parts and form a porous cellular foam structure. Features include No Solvent composition, easy to mix and apply, wide operating temperature, pot life for 3-4 minutes after mixing and forms complete cellular structure in 20 minutes.